To present the results of a survey taken concerning future applications for high-temperature electronics and sensors.
The spirit of this document is to provide initial industry testing parameters to: (1) Aid component manufacturers in identifying their components as high-temperature and reliable. (2) Aid system designers with a strong starting source of electronic components and sensors to reduce in-house qualifying and reduce development risks. (3) Aid end-users identifying systems built from manufacturer qualified components and sensors, assuring increased operating life and reliability. (4) To keep testing and documentation simple and easy to understand in order for the end consumer to see the benefits of components and systems meeting the listed requirements within this document. This document is not intended to be an application specification but a means to facilitate the evolution of a high-temperature electronics industry benefiting a large number of industrial applications including automotive, aerospace, deep drilling and electrical power grid. This document was written for consideration of new high-temperature components and not for manufacturer ongoing production testing.