Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates(NONCURRENT Apr 2001)

Standard:
Reaffirmed:
  • 2011-10-03
 
  • HISTORICAL Access the latest revision: AMS2690D
Publisher:
  • SAE International
Pages:
11
Scope:

This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.

History:
Standard Published Revision Status
AMS2690D 2017-09-19 Latest Stabilized
2011-10-03 Historical Reaffirmed
1993-05-01 Historical Reaffirmed
1982-04-01 Historical Revised
1968-05-01 Historical Issued
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