Resin, Polyimide, Sealing High-Temperature Resistant, 315 °C (600 °F) Unfilled (STABILIZED Oct 2016)

Standard:
Stabilized:
  • 2016-10-13
 
  • CURRENT
Publisher:
  • SAE International
Pages:
7
Scope:

This specification covers a single-component, unfilled, heatreactive, thermosetting, aromatic system which thermally cures to form a polyimide polymer structure.

Rationale:

This document has been determined to contain basic and stable technology which is not dynamic in nature.

History:
Standard Published Revision Status
AMS3684C 2016-10-13 Latest Stabilized
2011-08-12 Historical Reaffirmed
1993-01-01 Historical Noncurrent
1975-09-01 Historical Issued
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