Adhesive Compound, Epoxy, Room Temperature Curing
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Product Code: AMS3690
Date Published: 1960-01-01 - A newer version of this standard is available.
Issuing Committee:
Ams P Polymeric Materials Committee
Scope
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.
This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.
Product Status: In Stock
File Size:
88K
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| Current & Historical versions of this standard |
|---|
| Standard |
Date published |
?Status |
| AMS3690C |
2009-07-20 |
Revised |
| AMS3690B |
1993-01-01 |
Reaffirmed |
| AMS3690 |
1960-01-01 |
Issued |
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