Adhesive Compound, Epoxy, Room Temperature Curing
|
Product Code: AMS3690
Revision Number: C
Date Published: 2009-07-20
Issuing Committee:
Ams P17 Composite Materials Committee
Scope
This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.
This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.
Product Status: In Stock
File Size:
86K
Purchase more aerospace standards and aerospace material specifications and save!
AeroPaks offers a customized subscription plan that lets you pay
for just the documents that you need, when you need them.
Learn more >
| Current & Historical versions of this standard |
|---|
| Standard |
Date published |
?Status |
| AMS3690C |
2009-07-20 |
Revised |
| AMS3690B |
1993-01-01 |
Reaffirmed |
| AMS3690 |
1960-01-01 |
Issued |
|
Related Content
Papers
Books
Standards
- Tape, Woven, Nylon, 350 Pounds Force (1557 N)
- Tape, Low Modulus Aramid, 2 (51), 300 (1334) Breaking Strength
- Tape, Low Modulus Aramid, 2 (51), 3000 (13,345) Breaking Strength
|
