Adhesive Compound, Epoxy, Room Temperature Curing

Standard:
Revised:
  • 2009-07-20
 
  • HISTORICAL Access the latest revision: AMS3690D
Publisher:
  • SAE International
Pages:
6
Scope:

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste. This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.

Rationale:

AMS3690C results from a Five Year Review and update of this specification.

History:
Standard Published Revision Status
AMS3690D 2016-11-10 Latest Stabilized
2009-07-20 Historical Revised
2000-12-01 Historical Reaffirmed
1986-04-01 Historical Reaffirmed
1960-01-01 Historical Issued
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