Wave Soldering Procedure

Standard:
Revised:
  • 2007-02-20
 
  • HISTORICAL Access the latest revision: ARP1332D
Publisher:
  • SAE International
Pages:
12
Scope:

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards. In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.

Rationale:

This document revision was issued as part of the SAE Five Year Review process.

History:
Standard Published Revision Status
ARP1332D 2013-08-12 Latest Stabilized
2007-02-20 Historical Revised
1997-03-01 Historical Reaffirmed
1988-04-01 Historical Revised
1974-03-01 Historical Issued
AKA:
  • SAE ARP 1332
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