This document describes the requirements of the following test methods for counterfeit detection of electronic components:
a. Method A: General External Visual Inspection (EVI), Sample Selection, and Handling
b. Method B: Detailed EVI
c. Method C: Testing for Remarking and Resurfacing
d. Method D: Surface Texture Analysis by SEM
NOTE: The scope of this document was focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other electronic components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide but additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types.
Counterfeit electronic components frequently have external characteristics that may be used to identify them as suspect. Visual inspection by means of optical and scanning electron microscope (SEM) techniques requires well-defined processes in order to discern and document characteristics that are consistent with counterfeit parts..