This document describes the requirements of the following test methods for counterfeit detection of electronic components:
- Method A: General EVI, Sample Selection, and Handling
- Method B: Detailed EVI, including Part Weight measurement
- Method C: Testing for Remarking
- Method D: Testing for Resurfacing
- Method E: Part Dimensions measurement
- Method F: Surface Texture Analysis using SEM
The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If SAE AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
Counterfeit electronic components frequently have external characteristics that may be used to identify them as suspect. Visual inspection by means of optical and scanning electron microscope (SEM) techniques requires well-defined processes in order to discern and document characteristics that are consistent with counterfeit parts.
The published version of AS6171/2 was found to be different from the version that was balloted and approved by the G 19A committee. This revision is needed to address that discrepancy.