Environmental Tests and Associated Failure Mechanisms(STABILIZED Sep 2014)

Standard:
Stabilized:
  • 2014-09-12
 
  • CURRENT
Publisher:
  • SAE International
Pages:
13
Scope:

This document is an annex to EIA Engineering Bulletin SSB-1. Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications.

This document provides reference information concerning the environmental stresses associated with tests specifically designed to apply to (or have unique implications for) plastic encapsulated microcircuits and semiconductors, and the specific failures induced by these environmental stresses.

History:
Standard Published Revision Status
SSB1_002 2014-09-12 Latest Stabilized
AKA:
  • SAE SSB 1_002
Sector:
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