Parallel Gap Welding, Microelectronic Interconnections to Thin Film Substrates


This specification defines the equipment, procedures, and requirements for joining leads by parallel gap resistance welding. For attaching leads by parallel gap resistance welding in the assembly of microelectronic circuitry to thin film substrates.


RATIONALE AMS2690D stabilizes this document because this document contains mature technology that is not expected to change and thus no further revisions are anticipated. STABILIZED NOTICE AMS2690D has been declared "STABILIZED" by AMS Committee B Finishes, Processes and Fluids Committee. This document will no longer be updated and may no longer represent standard industry practice. Previously this document was reaffirmed non-current. The last technical update of this document occurred in July, 1988. Users of this document should refer any certification issues (e.g. exceptions listed on the certification report) to the cognizant engineering organization for their disposition. NOTE: In many cases the purchaser may be a sub tier supplier and not the cognizant engineering organization.

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