Potting Compound, Epoxy, Bisphenol A-Type, Unfilled, Room Temperature Cure, Semiflexible

Scope:

This specification covers an unfilled, room-temperature-polymerizing epoxy resin formulation with a polyamide hardener, supplied as a two-component system.

Rationale:

This document has been determined to contain basic and stable technology which is not dynamic in nature.

AKA:
  • SAE AMS 3731/10
Sector:
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