Evaluation of Pb-free Material within Electronic Piece Parts

Scope:

Piece part suppliers have been transition to using Pb-free solders within the parts themselves, such as Pb-free solder bumps. This document will provide guidance on necessary tests and evaluations for parts using Pb-free solders.

Rationale:

Users of these parts need to evaluate whether the risks associated with the use of these materials are acceptable. Many mil-aero programs have restrictions on Pb-free solders. Users are developing internal qualification and evaluation plans for these parts with lack of industry coordination.

AKA:
  • SAE ARP 6537
Sector:
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