Non-conformance and now Suspect counterfeit packaging represents a hazard to electrostatic discharge (ESD) sensitive devices or components through cross contamination during transport and storage while generating high voltage discharges to ESD sensitive devices during in shipping, the inspection process, handling and manufacturing. Several aerospace related issues involve long-term storage supplier non-conformance with antistatic foams, antistatic bubble, antistatic pink poly, vacuum formed antistatic polymers, Type I moisture barrier bags and Type III static shielding bags have posed issues. The late John Kolyer, Ph.D. (Boeing, Ret.) and Ray Gompf, P.E., Ph.D. (NASA-KSC, Ret.) were advocates in the utilization of a formalized physical testing material qualification process. Today, however, prime contractors and CMs rely heavily upon a visual inspection process for ESD packaging materials. Over the past 10 years, however, suspect counterfeit ESD packaging materials have compromised the supply chain which includes IC Carrier (The Dip Tube), JEDEC Trays and Tape & Reel.
This document is intended to provide guidance and requirements for the Test Laboratory in the receiption of possible suspect/counterfet EEE Parts packaging material.This includes various form of part packaging materials such as boxes, JEDEC Trays, IC Carriers, moisture barrier bags, static shielding bags, ESD foam and bags, tape & reel, conductive carriers, etc. Also covered are humidity indicator cards, dessicant, antistatic packing material, and proper labels. Paperbaord (corrugated containers), ESD Shielding & Moisture Barrier bags, JEDEC Trays, IC Carriers (Dip Tubes), static control foams, antistatic bubble, Kraft dunnage bulk, thermoformed vacuum formed or injection molded trays, and tape & reel.