This document describes the requirements of the following test methods for counterfeit detection of electronic components: Method A: General EVI, Sample Selection, and Handling Method B: Detailed EVI, including Part Weight measurement Method C: Testing for Remarking Method D: Testing for Resurfacing Method E: Part Dimensions measurement Method F: Surface Texture Analysis using SEM The scope of this document is focused on leaded electronic components, microcircuits, multi-chip modules (MCMs), and hybrids. Other EEE components may require evaluations not specified in this procedure. Where applicable this document can be used as a guide. Additional inspections or criteria would need to be developed and documented to thoroughly evaluate these additional part types. If SAE AS6171/2 is invoked in the contract, the base document, AS6171 General Requirements shall also apply.
The published version of AS6171/2 was found to be different from the version that was balloted and approved by the G-19A committee. This revision is needed to address that discrepancy.