Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications

Standard:
Scope:

This Engineering Bulletin and its annexes provide guidance to Original Equipment Manufacturers (OEMs) in evaluating device manufacturer flows and in selecting cost effective, standard products that meet the performance objective for potential use in many rugged, millitary, severe, or other environments.

Rationale:

The current document needs revisions so as to update it based on current industry practices

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